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Si5980DU
Vishay Siliconix
Dual N-Channel 100-V (D-S) MOSFET
PRODUCT SUMMARY
FEATURES
V DS (V)
100
R DS(on) ( Ω )
0.567 at V GS = 10 V
I D (A)
2.5
Q g (Typ.)
2.2 nC
? Halogen-free According to IEC 61249-2-21
Definition
? TrenchFET ? Power MOSFET
? New Thermally Enhanced PowerPAK ?
ChipFET ? Package
PowerPAK ? ChipFET Dual
1
- Small Footprint Area
- Low On-Resistance
- Thin 0.8 mm Profile
S 1
2
Marking Code
? Compliant to RoHS Directive 2002/95/EC
8
D 1
7
D 1
D 2
G 1
S 2
3
G 2
4
CE
XXX
Lot Traceability
and Date Code
Part # Code
APPLICATIONS
? Load Supply
? Power Supply
D 1
D 2
6
D 2
G 1
G 2
5
Bottom View
Ordering Information: Si5980DU-T1-GE3 (Lead (Pb)-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS T A = 25 °C, unless otherwise noted
S 1
N-Channel MOSFET
S 2
N-Channel MOSFET
Parameter
Drain-Source Voltage
Gate-Source Voltage
T C = 25 °C
Symbol
V DS
V GS
Limit
100
± 20
2.5
Unit
V
Continuous Drain Current (T J = 150 °C)
T C = 70 °C
T A = 25 °C
I D
2.0
1.3 b, c
Pulsed Drain Current
Continuous Source-Drain Diode Current
Single Pulse Avalanche Current
Avalanche Energy
T A = 70 °C
T C = 25 °C
T A = 25 °C
L = 0.1 mH
I DM
I S
I AS
E AS
1.0 b, c
3
6 a
1.7 b, c
2
0.2
A
mJ
T C = 25 °C
7.8
Maximum Power Dissipation
T C = 70 °C
T A = 25 °C
P D
5.0
2.0 b, c
W
T A = 70 °C
1.3 b, c
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) d, e
T J , T stg
- 55 to 150
260
°C
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient b, f t ≤ 5s
Maximum Junction-to-Case (Drain) Steady State
R thJA
R thJC
49 61
13 16
°C/W
Notes:
a. Package limited.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See Solder Profile ( www.vishay.com/ppg?73257 ). The PowerPAK ChipFET is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 110 °C/W.
Document Number: 65576
S10-0033-Rev. A, 11-Jan-10
www.vishay.com
1
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